23A256T-IPT-I/P
vs
N256S0830HDAT2-20I
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
AMI SEMICONDUCTOR
|
Part Package Code |
DIP
|
|
Package Description |
0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-8
|
4.40 MM, GREEN, PLASTIC, TSSOP-8
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.41
|
|
JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
Length |
9.271 mm
|
4.4 mm
|
Memory Density |
262144 bit
|
262144 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
32768 words
|
32768 words
|
Number of Words Code |
32000
|
32000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
32KX8
|
32KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.334 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
1.95 V
|
1.95 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
3 mm
|
Base Number Matches |
1
|
3
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e3/e4
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
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