23LC1024-I/ST
vs
23LC1024-E/ST
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.51
|
Factory Lead Time |
20 Weeks, 1 Day
|
18 Weeks, 4 Days
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Clock Frequency-Max (fCLK) |
20 MHz
|
16 MHz
|
I/O Type |
COMMON/SEPARATE
|
COMMON/SEPARATE
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e3
|
Length |
4.4 mm
|
4.4 mm
|
Memory Density |
1048576 bit
|
1048576 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
131072 words
|
131072 words
|
Number of Words Code |
128000
|
128000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
128KX8
|
128KX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Enable |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP8,.25
|
TSSOP8,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Standby Current-Max |
0.00001 A
|
0.00002 A
|
Standby Voltage-Min |
2.5 V
|
2.5 V
|
Supply Current-Max |
0.01 mA
|
0.01 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
SOIC
|
Package Description |
|
TSSOP-8
|
Pin Count |
|
8
|
|
|
|
Compare 23LC1024-I/ST with alternatives
Compare 23LC1024-E/ST with alternatives