27C64-20E/J
vs
8510203YX
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
0.600 INCH, CERDIP-28
|
DIP,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.61
|
8542.32.00.61
|
| Access Time-Max |
200 ns
|
200 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-GDIP-T28
|
R-GDIP-T28
|
| JESD-609 Code |
e0
|
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
EPROM
|
UVPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Organization |
8KX8
|
8KX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP28,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
13 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.0001 A
|
0.00014 A
|
| Supply Current-Max |
0.025 mA
|
0.01 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
7
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare 27C64-20E/J with alternatives
Compare 8510203YX with alternatives