29F01SDMQB vs AM2901CDCB feature comparison

29F01SDMQB Fairchild Semiconductor Corporation

Buy Now Datasheet

AM2901CDCB Rochester Electronics LLC

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP ROCHESTER ELECTRONICS LLC
Part Package Code DIP DIP
Package Description DIP, HERMETIC SEALED, CERDIP-40
Pin Count 40 40
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01
Clock Frequency-Max 25 MHz 32.26 MHz
External Data Bus Width 4 4
JESD-30 Code R-CDIP-T40 R-GDIP-T40
Number of Terminals 40 40
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified COMMERCIAL
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type BIT-SLICE MICROPROCESSOR BIT-SLICE MICROPROCESSOR
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Length 52.07 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.715 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

Compare 29F01SDMQB with alternatives