2N3055ESMD.MODR4
vs
BDX18
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
SEMELAB LTD
|
INTERSIL CORP
|
| Part Package Code |
TO-276AB
|
|
| Package Description |
CHIP CARRIER, R-CBCC-N3
|
FLANGE MOUNT, O-MBFM-P2
|
| Pin Count |
3
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Case Connection |
COLLECTOR
|
COLLECTOR
|
| Collector Current-Max (IC) |
15 A
|
15 A
|
| Collector-Emitter Voltage-Max |
60 V
|
60 V
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
20
|
20
|
| JEDEC-95 Code |
TO-276AB
|
TO-204AA
|
| JESD-30 Code |
R-CBCC-N3
|
O-MBFM-P2
|
| JESD-609 Code |
e4
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
2
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
METAL
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
CHIP CARRIER
|
FLANGE MOUNT
|
| Polarity/Channel Type |
NPN
|
PNP
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
GOLD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
PIN/PEG
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Transition Frequency-Nom (fT) |
2.5 MHz
|
0.8 MHz
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8541.29.00.95
|
| Operating Temperature-Max |
|
200 °C
|
| Power Dissipation Ambient-Max |
|
115 W
|
| Power Dissipation-Max (Abs) |
|
117 W
|
| Transistor Application |
|
SWITCHING
|
| VCEsat-Max |
|
1.1 V
|
|
|
|
Compare 2N3055ESMD.MODR4 with alternatives
Compare BDX18 with alternatives