2N4860UB
vs
2N4860E3
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
SURFACE MOUNT PACKAGE-3
|
CYLINDRICAL, O-MBCY-W3
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Configuration |
SINGLE
|
SINGLE
|
| DS Breakdown Voltage-Min |
30 V
|
30 V
|
| Drain-source On Resistance-Max |
40 Ω
|
40 Ω
|
| FET Technology |
JUNCTION
|
JUNCTION
|
| Feedback Cap-Max (Crss) |
8 pF
|
8 pF
|
| JESD-30 Code |
R-CDSO-N3
|
O-MBCY-W3
|
| JESD-609 Code |
e0
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Mode |
DEPLETION MODE
|
DEPLETION MODE
|
| Operating Temperature-Max |
175 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
METAL
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
SMALL OUTLINE
|
CYLINDRICAL
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Qualification Status |
Not Qualified
|
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
NO LEAD
|
WIRE
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
2
|
1
|
| JEDEC-95 Code |
|
TO-206AA
|
| Reference Standard |
|
MIL-19500/385
|
|
|
|
Compare 2N4860UB with alternatives
Compare 2N4860E3 with alternatives