2N5005
vs
JAN2N5005
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HERMETIC SEALED, METAL CAN-3
|
T6-C, TO-59, 3 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Factory Lead Time |
22 Weeks
|
22 Weeks
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Collector Current-Max (IC) |
5 A
|
5 A
|
| Collector-Emitter Voltage-Max |
80 V
|
80 V
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
40
|
40
|
| JEDEC-95 Code |
TO-59
|
TO-59
|
| JESD-30 Code |
O-MUPM-X3
|
O-MUPM-D3
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
200 °C
|
175 °C
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Polarity/Channel Type |
PNP
|
PNP
|
| Power Dissipation-Max (Abs) |
58 W
|
50 W
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
UNSPECIFIED
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
4
|
1
|
| HTS Code |
|
8541.29.00.95
|
| Reference Standard |
|
MIL-19500/535B
|
| Transition Frequency-Nom (fT) |
|
70 MHz
|
|
|
|
Compare 2N5005 with alternatives
Compare JAN2N5005 with alternatives