2N6660
vs
2N7002LT1G
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
DIGITRON SEMICONDUCTORS
|
ONSEMI
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
JESD-609 Code |
e0
|
e3
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn) - annealed
|
Base Number Matches |
28
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
SOT-23 (TO-236) 3 LEAD
|
Pin Count |
|
3
|
Manufacturer Package Code |
|
318-08
|
HTS Code |
|
8541.21.00.95
|
Factory Lead Time |
|
2 Days
|
Samacsys Manufacturer |
|
onsemi
|
Configuration |
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
|
60 V
|
Drain Current-Max (ID) |
|
0.115 A
|
Drain-source On Resistance-Max |
|
7.5 Ω
|
FET Technology |
|
METAL-OXIDE SEMICONDUCTOR
|
Feedback Cap-Max (Crss) |
|
5 pF
|
JEDEC-95 Code |
|
TO-236
|
JESD-30 Code |
|
R-PDSO-G3
|
Moisture Sensitivity Level |
|
1
|
Number of Elements |
|
1
|
Number of Terminals |
|
3
|
Operating Mode |
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
|
150 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
|
260
|
Polarity/Channel Type |
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
|
0.3 W
|
Qualification Status |
|
Not Qualified
|
Surface Mount |
|
YES
|
Terminal Form |
|
GULL WING
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Transistor Application |
|
SWITCHING
|
Transistor Element Material |
|
SILICON
|
|
|
|
Compare 2N7002LT1G with alternatives