2N7002E
vs
2N7002BK,215
feature comparison
Rohs Code |
|
Yes
|
Part Life Cycle Code |
|
Active
|
Ihs Manufacturer |
|
NEXPERIA
|
Part Package Code |
|
TO-236
|
Package Description |
|
ROHS COMPLIANT, PLASTIC PACKAGE-3
|
Pin Count |
|
3
|
Manufacturer Package Code |
|
SOT23
|
Reach Compliance Code |
|
compliant
|
ECCN Code |
|
EAR99
|
Samacsys Manufacturer |
|
Nexperia
|
Additional Feature |
|
LOGIC LEVEL COMPATIBLE
|
Configuration |
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
|
60 V
|
Drain Current-Max (ID) |
|
0.35 A
|
Drain-source On Resistance-Max |
|
1.6 Ω
|
FET Technology |
|
METAL-OXIDE SEMICONDUCTOR
|
JEDEC-95 Code |
|
TO-236AB
|
JESD-30 Code |
|
R-PDSO-G3
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Number of Elements |
|
1
|
Number of Terminals |
|
3
|
Operating Mode |
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
|
150 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
|
260
|
Polarity/Channel Type |
|
N-CHANNEL
|
Reference Standard |
|
AEC-Q101
|
Surface Mount |
|
YES
|
Terminal Finish |
|
TIN
|
Terminal Form |
|
GULL WING
|
Terminal Position |
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Transistor Application |
|
SWITCHING
|
Transistor Element Material |
|
SILICON
|
Base Number Matches |
|
1
|
|
|
|
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