2SC2351 vs BF747-T feature comparison

2SC2351 NEC Compound Semiconductor Devices Ltd

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BF747-T NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NEC COMPOUND SEMICONDUCTOR DEVICES LTD NXP SEMICONDUCTORS
Package Description MINIMOLD PACKAGE-3 SMALL OUTLINE, R-PDSO-G3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Additional Feature LOW NOISE
Collector Current-Max (IC) 0.07 A 0.05 A
Collector-Base Capacitance-Max 1 pF
Collector-Emitter Voltage-Max 12 V 20 V
Configuration SINGLE SINGLE
Highest Frequency Band ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND
JESD-30 Code R-PDSO-G3 R-PDSO-G3
Number of Elements 1 1
Number of Terminals 3 3
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Transistor Application AMPLIFIER AMPLIFIER
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 4500 MHz 1200 MHz
Base Number Matches 4 1
HTS Code 8541.21.00.75
DC Current Gain-Min (hFE) 40
Operating Temperature-Max 150 °C
Power Dissipation Ambient-Max 0.3 W
Reference Standard CECC

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