30MF30
vs
30KF30B
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NIHON INTER ELECTRONICS CORP
|
NIHON INTER ELECTRONICS CORP
|
Package Description |
O-MUPM-D1
|
R-PSFM-T3
|
Pin Count |
1
|
3
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Additional Feature |
HIGH RELIABILITY
|
|
Application |
ULTRA FAST RECOVERY
|
ULTRA FAST RECOVERY
|
Case Connection |
CATHODE
|
CATHODE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.25 V
|
1.25 V
|
JESD-30 Code |
O-MUPM-D1
|
R-PSFM-T3
|
Non-rep Pk Forward Current-Max |
450 A
|
450 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
1
|
3
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
30 A
|
30 A
|
Package Body Material |
METAL
|
PLASTIC/EPOXY
|
Package Shape |
ROUND
|
RECTANGULAR
|
Package Style |
POST/STUD MOUNT
|
FLANGE MOUNT
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
300 V
|
300 V
|
Reverse Current-Max |
50 µA
|
50 µA
|
Reverse Recovery Time-Max |
0.06 µs
|
0.06 µs
|
Surface Mount |
NO
|
NO
|
Terminal Form |
SOLDER LUG
|
THROUGH-HOLE
|
Terminal Position |
UPPER
|
SINGLE
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
TO-247AC
|
|
|
|