4608X-AP2-561LF
vs
CSC08A03560RGPA
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
BOURNS INC
|
VISHAY INTERTECHNOLOGY INC
|
| Package Description |
SIP, ROHS COMPLIANT
|
CHIP
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8533.21.00.50
|
|
| Factory Lead Time |
15 Weeks
|
10 Weeks
|
| Samacsys Manufacturer |
Bourns
|
Vishay
|
| Construction |
Epoxy Resin
|
Rectangular
|
| Element Power Dissipation |
0.3 W
|
0.3 W
|
| First Element Resistance |
560 Ω
|
560 Ω
|
| JESD-609 Code |
e1
|
e0
|
| Lead Length |
3.3 mm
|
3.3 mm
|
| Lead Spacing |
2.54 mm
|
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
| Network Type |
ISOLATED
|
ISOLATED
|
| Number of Elements |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
8.89 mm
|
4.95 mm
|
| Package Length |
20.27 mm
|
20.07 mm
|
| Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Package Style |
SIP
|
SIP
|
| Package Width |
2.49 mm
|
2.49 mm
|
| Packing Method |
AMMO PACK
|
Bulk
|
| Rated Power Dissipation (P) |
1 W
|
0.3 W
|
| Rated Temperature |
70 °C
|
70 °C
|
| Resistance |
560 Ω
|
560 Ω
|
| Resistor Type |
ARRAY/NETWORK RESISTOR
|
ARRAY/NETWORK RESISTOR
|
| Size Code |
8010
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Temperature Coefficient Tracking |
50 ppm/°C
|
50 ppm/°C
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Lead (Sn63Pb37)
|
| Terminal Shape |
FLAT
|
WIRE
|
| Tolerance |
2%
|
2%
|
| Working Voltage |
100 V
|
100 V
|
| Base Number Matches |
1
|
1
|
| Second/Last Element Resistance |
|
560 Ω
|
|
|
|
Compare 4608X-AP2-561LF with alternatives
Compare CSC08A03560RGPA with alternatives