47L04-I/ST
vs
MRF24WN0MA-I/RM
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TSSOP-8
|
ROHS COMPLIANT, MODULE-37
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
8542.39.00.01
|
| Factory Lead Time |
12 Weeks
|
|
| Date Of Intro |
2016-10-10
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Access Time-Max |
400 ns
|
|
| JESD-30 Code |
R-PDSO-G8
|
R-XXMA-N37
|
| JESD-609 Code |
e3
|
|
| Length |
4.4 mm
|
26.67 mm
|
| Memory Density |
4096 bit
|
|
| Memory IC Type |
MEMORY CIRCUIT
|
|
| Memory Width |
8
|
|
| Mixed Memory Type |
EEPROM+SRAM
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
|
| Number of Terminals |
8
|
37
|
| Number of Words |
512 words
|
|
| Number of Words Code |
512
|
|
| Operating Mode |
SYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512X8
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.2 mm
|
2.28 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
UNSPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3 mm
|
17.78 mm
|
| Base Number Matches |
1
|
2
|
| Supply Voltage-Nom |
|
3.3 V
|
| Telecom IC Type |
|
TELECOM CIRCUIT
|
|
|
|
Compare 47L04-I/ST with alternatives
Compare MRF24WN0MA-I/RM with alternatives