5560/BEA vs 5560/BEA feature comparison

5560/BEA NXP Semiconductors

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5560/BEA YAGEO Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS COMPONENTS
Part Package Code DIP
Package Description DIP, ,
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SWITCHING CONTROLLER SWITCHING CONTROLLER
Control Mode VOLTAGE-MODE VOLTAGE-MODE
Control Technique PULSE WIDTH MODULATION PULSE WIDTH MODULATION
Input Voltage-Max 30 V 18 V
Input Voltage-Min 20 V 10.5 V
Input Voltage-Nom 12 V 12 V
JESD-30 Code R-GDIP-T16 R-CDIP-T16
Length 19.05 mm
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Current-Max 0.04 A 0.04 A
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Surface Mount NO NO
Switcher Configuration SINGLE PUSH-PULL
Switching Frequency-Max 100 kHz 100 kHz
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1

Compare 5560/BEA with alternatives

Compare 5560/BEA with alternatives