5962-0053501QXA
vs
TSPC106AVGU66CG
feature comparison
| Rohs Code |
|
No
|
| Part Life Cycle Code |
|
Transferred
|
| Ihs Manufacturer |
|
ATMEL CORP
|
| Part Package Code |
|
BGA
|
| Package Description |
|
21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-303
|
| Pin Count |
|
303
|
| Reach Compliance Code |
|
unknown
|
| ECCN Code |
|
3A991.A.2
|
| HTS Code |
|
8542.31.00.01
|
| Samacsys Manufacturer |
|
Microchip
|
| Address Bus Width |
|
32
|
| Bus Compatibility |
|
60X; POWERPC 601; POWERPC 603; POWERPC 604
|
| Clock Frequency-Max |
|
66 MHz
|
| External Data Bus Width |
|
64
|
| JESD-30 Code |
|
R-CBGA-B303
|
| JESD-609 Code |
|
e0
|
| Length |
|
25 mm
|
| Number of Terminals |
|
303
|
| Operating Temperature-Max |
|
110 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA303,19X16,50
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
3.16 mm
|
| Supply Voltage-Max |
|
3.465 V
|
| Supply Voltage-Min |
|
3.135 V
|
| Supply Voltage-Nom |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
21 mm
|
| uPs/uCs/Peripheral ICs Type |
|
BUS CONTROLLER, PCI
|
| Base Number Matches |
|
1
|
|
|
|
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