5962-0622906QYC
vs
5962-0622904QYX
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
QFP-68
|
0.950 INCH, NCTB, CERAMIC, MQFP-68
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.32.00.71
|
8542.32.00.41
|
Access Time-Max |
18 ns
|
20 ns
|
I/O Type |
COMMON
|
|
JESD-30 Code |
S-XQFP-G68
|
S-CQFP-F68
|
JESD-609 Code |
e4
|
|
Length |
24.14 mm
|
24.14 mm
|
Memory Density |
16777216 bit
|
16777216 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
68
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
512KX32
|
512KX32
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
GQFP
|
QFF
|
Package Equivalence Code |
TPAK68,2.5SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, GUARD RING
|
FLATPACK
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Qualified
|
Not Qualified
|
Screening Level |
MIL-PRF-38535 Class Q
|
|
Seated Height-Max |
4.7 mm
|
4.7 mm
|
Standby Current-Max |
0.0045 A
|
|
Standby Voltage-Min |
2 V
|
|
Supply Current-Max |
0.17 mA
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
NICKEL GOLD
|
|
Terminal Form |
GULL WING
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.14 mm
|
24.14 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare 5962-0622906QYC with alternatives
Compare 5962-0622904QYX with alternatives