5962-3829411MXA vs 5962-3829434MYX feature comparison

5962-3829411MXA Pyramid Semiconductor Corporation

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5962-3829434MYX Pyramid Semiconductor Corporation

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Rohs Code No
Part Life Cycle Code Active Active
Ihs Manufacturer PERFORMANCE SEMICONDUCTOR CORP PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP QFJ
Package Description CERAMIC, DIP-28 QCCN,
Pin Count 28 32
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 45 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28 R-CQCC-N32
JESD-609 Code e0 e0
Memory Density 65536 bit 65536 bit
Memory IC Type OTHER SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8KX8 8KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP QCCN
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883 Class B (Modified)
Standby Current-Max 0.02 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.125 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL QUAD
Base Number Matches 1 1

Compare 5962-3829411MXA with alternatives

Compare 5962-3829434MYX with alternatives