5962-3829411MXA
vs
MAQ9264C95CD
feature comparison
Part Life Cycle Code |
Transferred
|
Contact Manufacturer
|
Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
DYNEX SEMICONDUCTOR LTD
|
Part Package Code |
DIP
|
|
Package Description |
CERAMIC, DIP-28
|
,
|
Pin Count |
28
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
45 ns
|
|
JESD-30 Code |
R-GDIP-T28
|
|
JESD-609 Code |
e0
|
|
Memory Density |
65536 bit
|
|
Memory IC Type |
STANDARD SRAM
|
|
Memory Width |
8
|
|
Number of Functions |
1
|
|
Number of Terminals |
28
|
|
Number of Words |
8192 words
|
|
Number of Words Code |
8000
|
|
Operating Mode |
ASYNCHRONOUS
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
8KX8
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
|
Package Code |
DIP
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Parallel/Serial |
PARALLEL
|
|
Qualification Status |
Not Qualified
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
|
Technology |
CMOS
|
|
Temperature Grade |
MILITARY
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Position |
DUAL
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 5962-3829411MXA with alternatives
Compare MAQ9264C95CD with alternatives