5962-8606301XA vs CY27C256A-200QMB feature comparison

5962-8606301XA Intel Corporation

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CY27C256A-200QMB Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer INTEL CORP ROCHESTER ELECTRONICS LLC
Part Package Code DIP QFJ
Package Description DIP, DIP28,.6 HERMETIC SEALED, WINDOWED, LCC-32
Pin Count 28 32
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 200 ns 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28 R-CQCC-N32
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP WQCCN
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER, WINDOW
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.5 V
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Standby Current-Max 0.0003 A
Supply Current-Max 0.05 mA 0.055 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Base Number Matches 1 1
Pbfree Code No
Length 13.97 mm
Seated Height-Max 2.794 mm
Width 11.43 mm

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Compare CY27C256A-200QMB with alternatives