5962-8757401QA
vs
N74F764AN
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
DIP, DIP40,.6
|
| Pin Count |
40
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
16
|
|
| Boundary Scan |
NO
|
|
| JESD-30 Code |
R-GDIP-T40
|
R-PDIP-T40
|
| JESD-609 Code |
e0
|
e0
|
| Low Power Mode |
NO
|
|
| Memory Organization |
64K X 8
|
|
| Number of Banks |
4
|
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
TTL
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
MEMORY CONTROLLER, DRAM
|
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| Package Equivalence Code |
|
DIP40,.6
|
| Supply Current-Max |
|
210 mA
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
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