5962-8765001LA vs PY291A-50WMB feature comparison

5962-8765001LA QP Semiconductor

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PY291A-50WMB Pyramid Semiconductor Corporation

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Part Life Cycle Code Transferred Active
Ihs Manufacturer QP SEMICONDUCTOR INC PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, 0.300 INCH, CERAMIC, DIP-24
Pin Count 24 24
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 50 ns 50 ns
JESD-30 Code R-GDIP-T24 R-CDIP-T24
JESD-609 Code e0 e0
Memory Density 16384 bit 16384 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 2KX8 2KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Seated Height-Max 5.08 mm
Supply Current-Max 0.09 mA
Terminal Pitch 2.54 mm
Width 7.62 mm

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