5962-8765005JA
vs
5962-8765005JA
feature comparison
| Part Life Cycle Code |
Transferred
|
|
| Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.32.00.61
|
|
| JESD-30 Code |
R-GDIP-T24
|
|
| Memory Density |
16384 bit
|
|
| Memory IC Type |
UVPROM
|
|
| Memory Width |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
24
|
|
| Number of Words |
2048 words
|
|
| Number of Words Code |
2000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
2KX8
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
|
| Package Code |
DIP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
MIL-STD-883
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Position |
DUAL
|
|
| Base Number Matches |
1
|
|
|
|
|
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