5962-8765005JA
vs
5962-8765005LX
feature comparison
| Part Life Cycle Code |
|
Transferred
|
| Ihs Manufacturer |
|
QP SEMICONDUCTOR INC
|
| Part Package Code |
|
DIP
|
| Package Description |
|
CERAMIC, DIP-24
|
| Pin Count |
|
24
|
| Reach Compliance Code |
|
unknown
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.32.00.61
|
| Access Time-Max |
|
25 ns
|
| JESD-30 Code |
|
R-GDIP-T24
|
| Memory Density |
|
16384 bit
|
| Memory IC Type |
|
UVPROM
|
| Memory Width |
|
8
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
24
|
| Number of Words |
|
2048 words
|
| Number of Words Code |
|
2000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
|
2KX8
|
| Package Body Material |
|
CERAMIC, GLASS-SEALED
|
| Package Code |
|
DIP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
IN-LINE
|
| Parallel/Serial |
|
PARALLEL
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
MILITARY
|
| Terminal Form |
|
THROUGH-HOLE
|
| Terminal Position |
|
DUAL
|
| Base Number Matches |
|
1
|
|
|
|
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