5962-8854702QX vs 5962-8854701QX feature comparison

5962-8854702QX Intel Corporation

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5962-8854701QX Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP ROCHESTER ELECTRONICS LLC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 40 40
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 20 20
Boundary Scan NO NO
Clock Frequency-Max 5 MHz 8 MHz
External Data Bus Width 16 16
JESD-30 Code R-CDIP-T40 R-CDIP-T40
Number of Terminals 40 40
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-PRF-38535
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology NMOS NMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MATH PROCESSOR, COPROCESSOR MATH PROCESSOR, COPROCESSOR
Base Number Matches 2 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 5962-8854702QX with alternatives

Compare 5962-8854701QX with alternatives