5962-8946304YC
vs
MC68882FN33
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
QFP, QFP68,1.1SQ,50
|
PLASTIC, LCC-68
|
| Pin Count |
68
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
5
|
5
|
| Barrel Shifter |
YES
|
YES
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
33.33 MHz
|
33.33 MHz
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-CQFP-G68
|
S-PQCC-J68
|
| JESD-609 Code |
e0
|
|
| Length |
24.13 mm
|
24.205 mm
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QCCJ
|
| Package Equivalence Code |
QFP68,1.1SQ,50
|
LDCC68,1.0SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535
|
|
| Seated Height-Max |
3.43 mm
|
4.57 mm
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
24.13 mm
|
24.205 mm
|
| uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
MATH PROCESSOR, COPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Bus Compatibility |
|
MC68882
|
|
|
|
Compare 5962-8946304YC with alternatives
Compare MC68882FN33 with alternatives