5962-8952405XA vs 5962-9461113HMA feature comparison

5962-8952405XA Micross Components

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5962-9461113HMA White Microelectronics

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROSS COMPONENTS WHITE MICROELECTRONICS
Part Package Code DIP
Package Description DIP, DIP28,.3 CO-FIRED CERAMIC,QFP-68
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 35 ns
I/O Type COMMON
JESD-30 Code R-CDIP-T28 S-CQFP-G68
JESD-609 Code e0 e0
Length 35.56 mm 22.352 mm
Memory Density 262144 bit 16777216 bit
Memory IC Type STANDARD SRAM SRAM MODULE
Memory Width 4 32
Number of Functions 1 1
Number of Terminals 28 68
Number of Words 65536 words 524288 words
Number of Words Code 64000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 64KX4 512KX32
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP QFP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 4.06 mm 5.08 mm
Standby Current-Max 0.001 A
Standby Voltage-Min 2 V
Supply Current-Max 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 7.62 mm 22.352 mm
Base Number Matches 1 1

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