5962-8952405XA vs 5962-9562409HNC feature comparison

5962-8952405XA Micross Components

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5962-9562409HNC Mercury Systems Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer MICROSS COMPONENTS MERCURY SYSTEMS INC
Part Package Code DIP
Package Description DIP, DIP28,.3 QFF,
Pin Count 28
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 20 ns
I/O Type COMMON
JESD-30 Code R-CDIP-T28 S-XQFP-F68
JESD-609 Code e0 e4
Length 35.56 mm 39.625 mm
Memory Density 262144 bit 16777216 bit
Memory IC Type STANDARD SRAM SRAM MODULE
Memory Width 4 32
Number of Functions 1 1
Number of Terminals 28 68
Number of Words 65536 words 524288 words
Number of Words Code 64000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 64KX4 512KX32
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package Code DIP QFF
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Qualified
Screening Level 38535Q/M;38534H;883B MIL-STD-883
Seated Height-Max 4.06 mm 5.1 mm
Standby Current-Max 0.001 A
Standby Voltage-Min 2 V
Supply Current-Max 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD GOLD
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 7.62 mm 39.625 mm
Base Number Matches 1 1
Additional Feature CONFIGURABLE AS 2M X 8
Alternate Memory Width 16

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