5962-8952405YC
vs
5962-9562409HNC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSS COMPONENTS
|
MERCURY SYSTEMS INC
|
| Part Package Code |
QLCC
|
|
| Package Description |
QCCN,
|
QFF,
|
| Pin Count |
28
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
25 ns
|
20 ns
|
| JESD-30 Code |
R-CQCC-N28
|
S-XQFP-F68
|
| JESD-609 Code |
e4
|
e4
|
| Length |
13.97 mm
|
39.625 mm
|
| Memory Density |
262144 bit
|
16777216 bit
|
| Memory IC Type |
STANDARD SRAM
|
SRAM MODULE
|
| Memory Width |
4
|
32
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
68
|
| Number of Words |
65536 words
|
524288 words
|
| Number of Words Code |
64000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
64KX4
|
512KX32
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
| Package Code |
QCCN
|
QFF
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Seated Height-Max |
2.03 mm
|
5.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
GOLD
|
GOLD
|
| Terminal Form |
NO LEAD
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
8.89 mm
|
39.625 mm
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
CONFIGURABLE AS 2M X 8
|
| Alternate Memory Width |
|
16
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare 5962-8952405YC with alternatives
Compare 5962-9562409HNC with alternatives