5962-8976901RA
vs
933835860025
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
DEFENSE LOGISTICS AGENCY
|
NXP SEMICONDUCTORS
|
Package Description |
FRIT SEALED, CERDIP-20
|
DIE,
|
Reach Compliance Code |
unknown
|
unknown
|
Additional Feature |
WITH HOLD MODE
|
|
Family |
HCT
|
HCT
|
JESD-609 Code |
e0
|
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
UNSPECIFIED
|
Package Code |
DIP
|
DIE
|
Package Style |
IN-LINE
|
UNCASED CHIP
|
Qualification Status |
Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
UPPER
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
7.62 mm
|
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Part Package Code |
|
DIE
|
HTS Code |
|
8542.39.00.01
|
JESD-30 Code |
|
R-XUUC-N
|
Package Shape |
|
RECTANGULAR
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Propagation Delay (tpd) |
|
48 ns
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
fmax-Min |
|
18 MHz
|
|
|
|
Compare 5962-8976901RA with alternatives
Compare 933835860025 with alternatives