5962-8984101LA vs 5962-8984101KA feature comparison

5962-8984101LA Lattice Semiconductor Corporation

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5962-8984101KA QP Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP QP SEMICONDUCTOR INC
Part Package Code DIP DFP
Package Description CERAMIC, DIP-24 DFP,
Pin Count 24 24
Reach Compliance Code not_compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 1 EXTERNAL CLOCK; REGISTER PRELOAD
Architecture PAL-TYPE
Clock Frequency-Max 22 MHz 22 MHz
JESD-30 Code R-GDIP-T24 R-GDFP-F24
Length 31.877 mm
Moisture Sensitivity Level 1
Number of Dedicated Inputs 11 11
Number of I/O Lines 10 10
Number of Inputs 22
Number of Outputs 10
Number of Product Terms 132
Number of Terminals 24 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DFP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Programmable Logic Type EE PLD EE PLD
Propagation Delay 30 ns 30 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 7 4
JESD-609 Code e0
Terminal Finish TIN LEAD

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