5962-8984501CA vs 74HCT132N,652 feature comparison

5962-8984501CA Intersil Corporation

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74HCT132N,652 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-GDIP-T14 R-PDIP-T14
JESD-609 Code e0 e4
Length 19.56 mm 19.025 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 50 ns 50 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 4.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Rohs Code Yes
Manufacturer Package Code SOT27-1
Samacsys Manufacturer NXP
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method BULK
Prop. Delay@Nom-Sup 41 ns
Schmitt Trigger YES

Compare 5962-8984501CA with alternatives

Compare 74HCT132N,652 with alternatives