5962-9318706HXC
vs
5962-9318702HUX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
AEROFLEX MICROELECTRONIC SOLUTIONS
|
AEROFLEX PLAINVIEW
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
45 ns
|
100 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
S-XPGA-P66
|
S-CHIP-P66
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
| Memory Width |
32
|
8
|
| Number of Terminals |
66
|
66
|
| Number of Words |
131072 words
|
524288 words
|
| Number of Words Code |
128000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
128KX32
|
512KX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
PGA
|
|
| Package Equivalence Code |
PGA66,11X11
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Standby Current-Max |
0.0116 A
|
|
| Standby Voltage-Min |
2 V
|
|
| Supply Current-Max |
0.6 mA
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
PERPENDICULAR
|
HEX
|
| Base Number Matches |
5
|
2
|
| Package Description |
|
,
|
| Additional Feature |
|
USER CONFIGURABLE AS 128K X 32
|
| Alternate Memory Width |
|
16
|
| Number of Functions |
|
1
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
|
|
|
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