5AGXFB5K4F40I3G
vs
5AGXFB5K4F40I3P
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
FBGA-1517
|
FBGA-1517
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B1517
|
S-PBGA-B1517
|
| Length |
40 mm
|
40 mm
|
| Number of CLBs |
15849
|
15849
|
| Number of Inputs |
704
|
704
|
| Number of Logic Cells |
420000
|
420000
|
| Number of Outputs |
704
|
704
|
| Number of Terminals |
1517
|
1517
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
15849 CLBS
|
15849 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HBGA
|
HBGA
|
| Package Equivalence Code |
BGA1517,39X39,40
|
BGA1517,39X39,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
2.7 mm
|
2.7 mm
|
| Supply Voltage-Max |
1.18 V
|
1.18 V
|
| Supply Voltage-Min |
1.12 V
|
1.12 V
|
| Supply Voltage-Nom |
1.15 V
|
1.15 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TSMC
|
TSMC
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
40 mm
|
40 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 5AGXFB5K4F40I3G with alternatives
Compare 5AGXFB5K4F40I3P with alternatives