6168SA35P
vs
6168LA35SO
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
PDIP
|
SOIC
|
Package Description |
DIP, DIP20,.3
|
|
Pin Count |
20
|
20
|
Manufacturer Package Code |
PD20
|
PS20
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
35 ns
|
35 ns
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-PDIP-T20
|
R-PDSO-G20
|
JESD-609 Code |
e0
|
e0
|
Memory Density |
16384 bit
|
16384 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
4
|
4
|
Moisture Sensitivity Level |
1
|
1
|
Number of Terminals |
20
|
20
|
Number of Words |
4096 words
|
4096 words
|
Number of Words Code |
4000
|
4000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
4KX4
|
4KX4
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP20,.3
|
SOP20,.4
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
245
|
225
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Voltage-Min |
4.5 V
|
2 V
|
Supply Current-Max |
0.1 mA
|
0.08 mA
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
4
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare 6168SA35P with alternatives
Compare 6168LA35SO with alternatives