7005S55GG8 vs IDT70V05S55PF9 feature comparison

7005S55GG8 Integrated Device Technology Inc

Buy Now Datasheet

IDT70V05S55PF9 Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description PGA, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code S-CPGA-P68 S-PQFP-G64
Memory Density 65536 bit 65536 bit
Memory IC Type DUAL-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 68 64
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX8 8KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code PGA LQFP
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form PIN/PEG GULL WING
Terminal Position PERPENDICULAR QUAD
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 1 1
Pbfree Code No
Part Package Code QFP
Pin Count 64
Additional Feature INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
JESD-609 Code e0
Length 14 mm
Moisture Sensitivity Level 3
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Terminal Finish TIN LEAD
Terminal Pitch 0.8 mm
Width 14 mm

Compare 7005S55GG8 with alternatives

Compare IDT70V05S55PF9 with alternatives