7006S25PF8
vs
5962-8861005ZA
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
|
| Part Package Code |
TQFP
|
|
| Package Description |
14 X 14 MM, 1.40 MM HEIGHT, TQFP-64
|
|
| Pin Count |
64
|
|
| Manufacturer Package Code |
PN64
|
|
| Reach Compliance Code |
not_compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.41
|
|
| Access Time-Max |
25 ns
|
|
| Additional Feature |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
|
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
S-PQFP-G64
|
|
| JESD-609 Code |
e0
|
|
| Length |
14 mm
|
|
| Memory Density |
131072 bit
|
|
| Memory IC Type |
MULTI-PORT SRAM
|
|
| Memory Width |
8
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Ports |
2
|
|
| Number of Terminals |
64
|
|
| Number of Words |
16384 words
|
|
| Number of Words Code |
16000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
16KX8
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LQFP
|
|
| Package Equivalence Code |
QFP64,.66SQ,32
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK, LOW PROFILE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.6 mm
|
|
| Standby Current-Max |
0.015 A
|
|
| Standby Voltage-Min |
4.5 V
|
|
| Supply Current-Max |
0.265 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
14 mm
|
|
| Base Number Matches |
2
|
|
|
|
|
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