70T05L20PF8 vs 70T05L20PF feature comparison

70T05L20PF8 Integrated Device Technology Inc

Buy Now Datasheet

70T05L20PF Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TQFP TQFP
Package Description 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 LQFP,
Pin Count 64 64
Manufacturer Package Code PN64 PN64
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e0 e0
Length 14 mm 14 mm
Memory Density 65536 bit 65536 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX8 8KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.4 mm
Supply Voltage-Max (Vsup) 2.6 V 2.6 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 14 mm 14 mm
Base Number Matches 2 10
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE

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Compare 70T05L20PF with alternatives