70T653MS10BCG
vs
CYDD18S18V18-200BBXC
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
CABGA
|
BGA
|
| Pin Count |
256
|
256
|
| Manufacturer Package Code |
BCG256
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
NLR
|
3A991.B.2.A
|
| HTS Code |
8542320041
|
8542.32.00.41
|
| Factory Lead Time |
26 Weeks, 1 Day
|
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Access Time-Max |
10 ns
|
7.2 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e1
|
e1
|
| Length |
17 mm
|
19 mm
|
| Memory Density |
18874368 bit
|
18874368 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
36
|
36
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
256
|
256
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
512KX36
|
512KX36
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.5 mm
|
1.7 mm
|
| Standby Current-Max |
0.02 A
|
0.3 A
|
| Standby Voltage-Min |
2.4 V
|
1.5 V
|
| Supply Current-Max |
0.81 mA
|
0.8 mA
|
| Supply Voltage-Max (Vsup) |
2.6 V
|
1.58 V
|
| Supply Voltage-Min (Vsup) |
2.4 V
|
1.42 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
| Width |
17 mm
|
19 mm
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
19 X 19 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256
|
| Additional Feature |
|
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V
|
| Clock Frequency-Max (fCLK) |
|
200 MHz
|
|
|
|
Compare 70T653MS10BCG with alternatives
Compare CYDD18S18V18-200BBXC with alternatives