70V07L25PFG
vs
7007S25J8
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TQFP
|
PLCC
|
| Pin Count |
80
|
68
|
| Manufacturer Package Code |
PNG80
|
PL68
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
NLR
|
EAR99
|
| HTS Code |
8542320041
|
8542.32.00.41
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Access Time-Max |
25 ns
|
25 ns
|
| Additional Feature |
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
|
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
S-XQFP-F80
|
S-PQCC-J68
|
| JESD-609 Code |
e3
|
e0
|
| Length |
14 mm
|
24.2062 mm
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
80
|
68
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
32KX8
|
32KX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
QFF
|
QCCJ
|
| Package Equivalence Code |
QFP80,.64SQ
|
LDCC68,1.0SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
225
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
4.57 mm
|
| Standby Current-Max |
0.003 A
|
0.015 A
|
| Standby Voltage-Min |
3 V
|
4.5 V
|
| Supply Current-Max |
0.14 mA
|
0.305 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
FLAT
|
J BEND
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
| Width |
14 mm
|
24.2062 mm
|
| Base Number Matches |
2
|
2
|
| Package Description |
|
0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68
|
|
|
|
Compare 70V07L25PFG with alternatives
Compare 7007S25J8 with alternatives