70V9269L12PRFGI8 vs IDT70V9269L12PRF9 feature comparison

70V9269L12PRFGI8 Integrated Device Technology Inc

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IDT70V9269L12PRF9 Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TQFP QFP
Pin Count 128 128
Manufacturer Package Code PKG128
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
JESD-609 Code e3 e0
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Moisture Sensitivity Level 3 3
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Terminal Finish TIN Tin/Lead (Sn/Pb)
Base Number Matches 2 1
Package Description 14 X 20 MM, 1.40 MM HEIGHT, TQFP-128
Access Time-Max 25 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code R-PQFP-G128
Length 20 mm
Memory Density 262144 bit
Memory Width 16
Number of Functions 1
Number of Ports 2
Number of Terminals 128
Number of Words 16384 words
Number of Words Code 16000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 16KX16
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Shape RECTANGULAR
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm

Compare 70V9269L12PRFGI8 with alternatives

Compare IDT70V9269L12PRF9 with alternatives