7140LA25PFI8
vs
7140LA25JGB
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TQFP
|
LCC
|
| Package Description |
TQFP-64
|
QCCJ, LDCC52,.8SQ
|
| Pin Count |
64
|
52
|
| Manufacturer Package Code |
PN64
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
25 ns
|
25 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQCC-J52
|
| JESD-609 Code |
e0
|
e3
|
| Length |
14 mm
|
19.1262 mm
|
| Memory Density |
8192 bit
|
8192 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
64
|
52
|
| Number of Words |
1024 words
|
1024 words
|
| Number of Words Code |
1000
|
1000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Organization |
1KX8
|
1KX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
QCCJ
|
| Package Equivalence Code |
QFP64,.66SQ,32
|
LDCC52,.8SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
4.572 mm
|
| Standby Current-Max |
0.004 A
|
0.004 A
|
| Standby Voltage-Min |
2 V
|
2 V
|
| Supply Current-Max |
0.22 mA
|
0.22 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.8 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
14 mm
|
19.1262 mm
|
| Base Number Matches |
2
|
4
|
| Screening Level |
|
MIL-PRF-38535 Class Q
|
|
|
|
Compare 7140LA25PFI8 with alternatives
Compare 7140LA25JGB with alternatives