7164L25TPGI vs CY7C199-25DMB feature comparison

7164L25TPGI Renesas Electronics Corporation

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CY7C199-25DMB Rochester Electronics LLC

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP ROCHESTER ELECTRONICS LLC
Package Description DIP-28 0.300 INCH, CERDIP-28
Reach Compliance Code compliant unknown
Access Time-Max 25 ns 25 ns
JESD-30 Code R-PDIP-T28 R-GDIP-T28
JESD-609 Code e3
Length 34.671 mm 37.0205 mm
Memory Density 65536 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 32768 words
Number of Words Code 8000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 8KX8 32KX8
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 4.572 mm 5.08 mm
Supply Current-Max 0.3 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Additional Feature AUTOMATIC POWER-DOWN
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 7164L25TPGI with alternatives

Compare CY7C199-25DMB with alternatives