71V016SA20BFI
vs
IS65C6416AL-45TA3
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED SILICON SOLUTION INC
|
| Part Package Code |
CABGA
|
TSOP2
|
| Package Description |
7 X 7 MM, PLASTIC, FBGA-48
|
PLASTIC, TSOP2-44
|
| Pin Count |
48
|
44
|
| Manufacturer Package Code |
BF48
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Date Of Intro |
1996-08-01
|
|
| Access Time-Max |
20 ns
|
45 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
S-PBGA-B48
|
R-PDSO-G44
|
| JESD-609 Code |
e0
|
e0
|
| Length |
7 mm
|
18.415 mm
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
16
|
16
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
44
|
| Number of Words |
65536 words
|
65536 words
|
| Number of Words Code |
64000
|
64000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
64KX16
|
64KX16
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
TSOP2
|
| Package Equivalence Code |
BGA48,6X8,30
|
TSOP44,.46,32
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.34 mm
|
1.2 mm
|
| Standby Current-Max |
0.01 A
|
0.000125 A
|
| Standby Voltage-Min |
3.15 V
|
2 V
|
| Supply Current-Max |
0.12 mA
|
0.045 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.75 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
7 mm
|
10.16 mm
|
| Base Number Matches |
2
|
1
|
| Screening Level |
|
AEC-Q100
|
|
|
|
Compare 71V016SA20BFI with alternatives
Compare IS65C6416AL-45TA3 with alternatives