71V2546XS150BGG8 vs CY7C1386FV25-250BGI feature comparison

71V2546XS150BGG8 Integrated Device Technology Inc

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CY7C1386FV25-250BGI Cypress Semiconductor

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description BGA, 14 X 22 MM, 2.40 MM HEIGHT, BGA-119
Pin Count 119 119
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.8 ns 2.6 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e1 e0
Length 22 mm 22 mm
Memory Density 4718592 bit 18874368 bit
Memory IC Type ZBT SRAM CACHE SRAM
Memory Width 36 36
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 131072 words 524288 words
Number of Words Code 128000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX36 512KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 2.36 mm 2.4 mm
Supply Voltage-Max (Vsup) 3.465 V 2.625 V
Supply Voltage-Min (Vsup) 3.135 V 2.375 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Qualification Status Not Qualified

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Compare CY7C1386FV25-250BGI with alternatives