71V2546XS150BGG8 vs K7I161884B-FC16 feature comparison

71V2546XS150BGG8 Integrated Device Technology Inc

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K7I161884B-FC16 Samsung Semiconductor

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, LBGA, BGA165,11X15,40
Pin Count 119 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.8 ns 0.5 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B119 R-PBGA-B165
JESD-609 Code e1 e0
Length 22 mm 15 mm
Memory Density 4718592 bit 18874368 bit
Memory IC Type ZBT SRAM DDR SRAM
Memory Width 36 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 119 165
Number of Words 131072 words 1048576 words
Number of Words Code 128000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX36 1MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 2.36 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.465 V 1.9 V
Supply Voltage-Min (Vsup) 3.135 V 1.7 V
Supply Voltage-Nom (Vsup) 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 13 mm
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 166.66 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA165,11X15,40
Qualification Status Not Qualified
Standby Current-Max 0.14 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.3 mA

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