71V3577S85BQ8 vs 71V3577S85BQI feature comparison

71V3577S85BQ8 Renesas Electronics Corporation

Buy Now Datasheet

71V3577S85BQI Renesas Electronics Corporation

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code End Of Life End Of Life
Ihs Manufacturer RENESAS ELECTRONICS CORP RENESAS ELECTRONICS CORP
Part Package Code CABGA CABGA
Package Description CABGA-165 CABGA-165
Pin Count 165 165
Manufacturer Package Code BQ165 BQ165
Reach Compliance Code not_compliant not_compliant
ECCN Code NLR NLR
HTS Code 8542320041 8542320041
Factory Lead Time 26 Weeks, 1 Day 26 Weeks, 1 Day
Samacsys Manufacturer Renesas Electronics Renesas Electronics
Access Time-Max 8.5 ns 8.5 ns
Additional Feature FLOW THROUGH ARCHITECTURE FLOW THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK) 87 MHz 87 MHz
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0 e0
Length 15 mm 15 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 165 165
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 128KX36 128KX36
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Equivalence Code BGA165,11X15,40 BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Reverse Pinout NO NO
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.03 A 0.035 A
Standby Voltage-Min 3.14 V 3.14 V
Supply Current-Max 0.18 mA 0.19 mA
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 13 mm 13 mm
Base Number Matches 1 2

Compare 71V3577S85BQ8 with alternatives

Compare 71V3577S85BQI with alternatives