71V67603S150PFG
vs
UPD4382362GF-A67
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
TQFP
|
|
| Package Description |
14 X 20 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MO-136BX, TQFP-100
|
|
| Pin Count |
100
|
|
| Manufacturer Package Code |
PKG100
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Date Of Intro |
1997-09-16
|
|
| Access Time-Max |
3.8 ns
|
3.8 ns
|
| Additional Feature |
PIPELINED ARCHITECTURE
|
|
| Clock Frequency-Max (fCLK) |
150 MHz
|
150 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
| JESD-609 Code |
e3
|
e0
|
| Length |
20 mm
|
|
| Memory Density |
9437184 bit
|
9437184 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
36
|
36
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
100
|
100
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
256KX36
|
256KX36
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
QFP
|
| Package Equivalence Code |
QFP100,.63X.87
|
QFP100,.63X.87
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
|
| Standby Current-Max |
0.05 A
|
0.01 A
|
| Standby Voltage-Min |
3.14 V
|
3.14 V
|
| Supply Current-Max |
0.305 mA
|
0.4 mA
|
| Supply Voltage-Max (Vsup) |
3.465 V
|
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
14 mm
|
|
| Base Number Matches |
3
|
2
|
|
|
|
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