74AC32PW vs MC74AC32DT feature comparison

74AC32PW Philips Semiconductors

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MC74AC32DT Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS MOTOROLA INC
Package Description TSSOP, TSSOP14,.25 SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.012 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Prop. Delay@Nom-Sup 9 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 4
Part Package Code SOIC
Pin Count 14
Family AC
Length 8.65 mm
Number of Functions 4
Number of Inputs 2
Propagation Delay (tpd) 7.5 ns
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Width 3.9 mm

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