74AHC132BQ,115 vs 74AHC132BQ feature comparison

74AHC132BQ,115 Nexperia

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74AHC132BQ NXP Semiconductors

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Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code QFN QFN
Package Description HVQCCN, HVQCCN,
Pin Count 14 14
Manufacturer Package Code SOT762-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 6 Weeks
Samacsys Manufacturer Nexperia
Family AHC/VHC/H/U/V AHC/VHC/H/U/V
JESD-30 Code R-PQCC-N14 R-PQCC-N14
JESD-609 Code e4
Length 3 mm 3 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN HVQCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method TR, 7 INCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 19.5 ns 19.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 2.5 mm 2.5 mm
Base Number Matches 1 5
Rohs Code Yes

Compare 74AHC132BQ,115 with alternatives

Compare 74AHC132BQ with alternatives