74AUP1G126GW vs SN74AUC1G125YEPR feature comparison

74AUP1G126GW NXP Semiconductors

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SN74AUC1G125YEPR Rochester Electronics LLC

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code TSSOT BGA
Package Description 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5 DSBGA-5
Pin Count 5 5
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer NXP
Control Type ENABLE HIGH
Family AUP/ULP/V AUC
JESD-30 Code R-PDSO-G5 R-XBGA-B5
JESD-609 Code e3 e0
Length 2.05 mm 1.4 mm
Load Capacitance (CL) 30 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TSSOP VFBGA
Package Equivalence Code TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 20.4 ns
Propagation Delay (tpd) 24 ns 3.6 ns
Qualification Status Not Qualified
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 2.7 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn) TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 1.25 mm 0.9 mm
Base Number Matches 2 1

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Compare SN74AUC1G125YEPR with alternatives